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datashee t 1/22 datashee t tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 14? 001 product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. system motor driver series for cd ? dvd ? bd players 3ch system motor driver for car audio BD8271EFV general description BD8271EFV is 3ch power driver developed for driving stepper motor and dc motor (or actuator coil). blu-ray?s motor & coil can be driven, when used along with 6ch dvd power driver. features each driver of sled (2ch) and actuator (1ch) are installed in a single-chip. on/off and the standby mode of 3ch can be selected using two control terminals. built-in triangular wave generator circuit. adopts htssop-b24 package that has high power dissipation. built-in thermal shutdown function. highly effective sled driver with pwm drive system. built-in 2ch sled driver that corresponds to the stepper motor drive. the actuator driver is linear btl type. applications car audio key specifications power supply voltage operating temperature range output on resistance (sled) output saturation voltage (actuator) 4.5v to 14v -40c to +85c 2.2 ? (typ) 0.9 v (typ) package w(typ) d(typ) h(max) htssop-b24 7.80mm x 7.60mm x 1.00mm typical application circuit figure 1. application circuit htssop-b24
2/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 pin configuration pin description figure 2. pin configuration block diagram figure 3. block diagram pin no. symbol function 1 vmfc power supply for btl 2 pgnd2 power ground 2 3 fco- focus driver negative output 4 fco+ focus driver positive output 5 sao1- stepper driver 1 negative output 6 sao1+ stepper driver 1 positive output 7 sao2- stepper driver 2 negative output 8 sao2+ stepper driver 2 positive output 9 pgnd1 power ground 1 10 n.c. - 11 sarnf1 stepper driver 1 current detection 12 sarnf2 stepper driver 2 current detection 13 sa2ino output for stepper driver 2 pre-opamp 14 sa2inn inverting input for stepper driver 2 pre-opamp 15 sa1ino output for stepper driver 1 pre-opamp 16 sa1inn inverting input for stepper driver 1 pre-opamp 17 vcc pre-block power supply 18 finn inverting input for focus driver pre-opamp 19 fino output for focus driver pre-opamp 20 ctl2 driver logic control input 2 21 ctl1 driver logic control input 1 22 vc2 control standard voltage input 2 23 vc1 control standard voltage input 1 24 pregnd pre-block ground (top view) 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 vmfc pregnd pgnd2 fco- fco+ sao1- sao1+ sao2- sao2+ pgnd1 n.c. sarnf1 sarnf2 vc1 vc2 ctl1 ctl2 fino finn vcc sa1inn sa1ino sa2inn sa2ino
3/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings (ta=25c) parameter symbol rating unit mos output power supply voltage v savm ,v sarnf 15 (note 1) v btl output power supply voltage v vmfc 15 v pre-block power supply voltage v vcc 15 v input terminal voltage 1 v in1 (note 2) v vcc v input terminal voltage 2 v in2 (note 3) v savm v power dissipation pd 1.1 (note 4) w 4.0 (note 5) operating temperature range topr -40 to +85 c storage temperature tstg -55 to +150 c junction temperature tjmax +150 c (note 1) power mos output terminals are contained. (note 2) vin1 supplies the following terminals ctl1, ctl2, vc1, vc2, finn (note 3) vin2 supplies the following terminals sa1inn, sa2inn (note 4) rated for 70mm70mm1.6mm, one layer substrate (back copper foil 0mm0mm), derated by 8.8mw/c when operating above ta =25c. (note 5) rated for 70mm70mm1.6m m, four layer substrate (back copper foil 70m m70mm), derated by 32.0mw/c when operating abov e ta=25c. caution : operating the ic over the absolute maximum ratings may dama ge the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. ther efore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +85c) parameter symbol min typ max unit pre-block power supply voltage (note 1) v vcc 4.5 8.0 14 v actuator driver power supply voltage (note 1) v vmfc 4.5 8.0 v vcc v sled driver power supply voltage (note 1) v sarnf 4.5 8.0 v vcc v (note 1) consider power consumptio n when deciding power supply voltage.
4/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unless otherwise noted, ta=25c, v vcc =v savm =8v, v vmfc =5v, v vc1 =v vc2 =1.65v, r sarnf1 =r sarnf2 =0.5 ?) parameter symbol limit unit conditions min typ max standby current i st - 0.6 0.9 ma quiescent current i q - 11.2 17.0 ma at no load input dead zone (one side) v dzsa 5 15 30 mv input-output gain gm sa 425 500 575 ma/v input offset voltage v iosa -5 - +5 mv input bias current i biassa -300 -50 -10 na output on-resistance (total) r onsa - 2.2 3.7 ? i l =500ma output limit current i limsa 672 800 928 ma pwm frequency f osc - 113 - khz output offset voltage v offt -50 0 +50 mv output saturation voltage (total) v oft - 0.9 1.6 v i l =500ma voltage gain g vft 10.5 12 13.5 db l input voltage v il gnd - 0.8 v h input voltage v ih 2 - vcc v high level input current i cth - 50 100 a v ctl1 , v ctl2 =3.3v input offset voltage v ioact -5 0 +5 mv input bias current i biasact -300 -50 -10 na vc1 drop mute voltage v mvc1 0.4 0.7 1 v vc2 drop mute voltage v mvc2 0.4 0.7 1 v vcc drop mute voltage v mvcc 3.4 3.8 4.2 v vc1 input current i vc1 - 4 8 a vc2 input current i vc2 - 4 8 a
5/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 application information 1. driver control (ctl1, ctl2, vc1, vc2) all driver output conditions are controlled by swit ching the ctl1 and ctl2 terminals to high and low levels. the table below shows the logic. (1) high and low levels terminal pin no l h ctl1 pin21 less than 0.8v more than 2v ctl2 pin20 vc1 pin23 less than 0.4v more than 1v vc2 pin22 (2) driver output conditions ctl1 [pin21] ctl2 [pin20] sled (n o t e 1) btl l l stby stby l h sb active h l active mute h h active active (note 1) refer to the table no.(3). (a) at vc1=l, stepper outputs become mute (vc1 drop mute). (b) at vc2=l, btl outputs become mute (vc2 drop mute). (c) at stby, pre-opamp, internal amplifie r, and all outputs are off. outputs become hi -z. at mute, all outputs are off. outputs become hi -z. (d) the states of each terminal at stby and mute at stby, input terminals (pin13, 14, 15, 16, 18, 19) become hi - z and can not accept any input. in this case, each vc1 and vc2 terminal (pin23, 22) is pulled-down to gnd with an internal resistance of 360k ? (typ). at mute, btl outputs are pulled-up to the volt age of vmfc/2 by an internal resistance of 20k ? (typ). at vcc drop mute, vc1, 2 drop mute and thermal shut down, outputs become hi-z same as mute. (3)mode table for sled mode operation active normal operation sb compulsion short brake (n o t e 2 ) (note 2) in this mode, both outputs (positive and negat ive) of sled driver become low regardless of sain input.
6/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 2. torque command for sled driver the relation between the torque command input and the output cu rrent detection terminals input is expressed as shown below: figure 4. sled input vs output current the input-output gain (gm sa ) and the output limit current (i limsa ) depend on the resistance of r sarnf1, 2 (output current detection resistor). refer to t he formula in the table below. the gain for sled driver can be adj usted by pre-opamp resistors. the table below shows the output terminal conditions for sled driver during dead zone and current limit detection: (1) state of output terminals sled input dead zone short brake when limit operates short brake (2) gain formula (typ) sled input-output gain gm sa = 0.25 / r sarnf1, 2 (a/v) output limit current i limsa = 0.4 / r sarnf1, 2 (a) input-output gain with resistor connected gm sa r2/r1 (a/v) (r2/r1 is pre-opamp gain) 3. pwm oscillation frequency (sled) the pwm oscillation for sled driver is continuous. the oscillating frequency is 113khz (typ). 4. vcc drop mute if vcc terminal voltage becomes 3.8v (typ) or less, all output channels turn off. 5. thermal shutdown circuit (tsd) thermal shutdown circuit is designed to turn off all output channels when the junction temperat ure (tj) reaches 175c (typ) (with 25c (typ) hysteresis).
7/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 noise suppression the following are possible causes of noise of the pwm driver. a. noise from power line or ground b. radiated noise 1. countermeasures against a (1) reduce wiring impedance on 8v system power supply ( sarnf1, sarnf2, vcc), 5v system power supply (vmfc) and power gnd (pgnd1, pgnd2) lines where high current flows. ma ke sure that they are separated from power supply lines of the other devices so that they do not have common impedance. (figure 5.) figure 5. pattern example (2) provide a low esr electrolytic capacitor between the power terminal and the ground terminal of the driver to achieve strong stabilization. provide a ceramic capacitor with good high frequency property next to the ic. also provide a ceramic capacitor with good high frequency property between sarnf1, 2 and pgnd1. (figure 6.) this can reduce power supply ripple due to pwm switching. 0.1f 0.1f r sarnf1,2 sarnf1,2 pgnd1(pin9) savm pgnd1(pin9) figure 6. position of ceramic capacitors separate as much as possible. other devices
8/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 (a) power supply system *number in circles is the pin number. savm=8v sa input sa predrive sa output 11,12 5 8 fc output fc predrive 3 4 2 17 24 r sarnf 0.5 ? pgnd1 for sa pregnd pgnd2 for act 9 vcc=8v 1 vmfc=5v figure 7. power supply and ground connection of internal block
9/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 (3) if there?s no improvement with the condition (1) and (2), there are two improvement way. the first way is to insert an lc filter in t he power line or in the ground line. (figure 8.) figure 8. example of lc filter (4) the second way is to add a capacitor of around 2200 pf between each output and the ground. in this case, ensure that the gnd wiring should not have any common im pedance with other signals. (figure 9.) 2200pf pwm output- pwm output+ figure 9. snubber circuit 47f 120h pwm driver ic vcc gnd 47f 120h pwm driver ic gnd vcc 47f 120h pwm driver ic gnd vcc 120h 0.1f 0.1f 0.1f
10/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 2. countermeasures against b (refer to figure 10) (1) ensure certain distance between rf signal line and pwm-dri ve output line. if it?s not possi ble to provide space between these lines, shield the rf signal line wi th a stable gnd except for power gnd. (2) same as (1), flexible cable for pickup should be shielded with gnd in order to separate noise between the signal line and the actuator drive output line. (3) separate the flexible cable for the motor and for the pickup. actuator output rf pick up gnd sled output BD8271EFV gnd shield flexible cable for pickup make sure to separate from gnd of driver and motor pcb flexible cable for stepping motor gnd shield figure 10. countermeasure for rf noise
11/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 gain calculation 1. actuator (with pre-opamp) r in inn vc1 2 vo + vo - v in r in r r ino 2v in 2 vo + - vo - ) 4 times between outputs vref vo + vo - vc1 2 r f r in 2v in r f r in vref level shift vref + vref - figure 11. gain calculation for actuator 2. sled (with pre-opamp) figure 12. gain calculation for sled l o o sarnf in r v i r 25.0 v iopeak ? ? l sarnf in r r 25.0 v vopeak ? ? 22 r r = v v =gain in f in o () db12=22 k10 k10 =gain k10.exr=r fin at input resistor r in connect [] [] v/vr r 25.0 r r = v vopeal v/a r 25.0 r r = v iopeak l sarnf in f in sarnf in f in r in inn vc2 v in r in r r f ino sarnf r sarnf sao + sao - r l vo io io : iopeak vc2
12/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 typical application circuit figure 13. typical application circuit
13/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 power dissipation figure 14. power dissipation board size : 70mm70mm1.6mm the board and the thermal plate of the ic are connected with solder. board (1): 1 layer board (copper foil 0mm 0mm) board (2): 2 layer board (copper foil 15mm 15mm) board (3): 2 layer board (copper foil 70mm 70mm) board (4): 4 layer board (copper foil 70mm 70mm) board (1) : ja = 113.6 c/w board (2) : ja = 73.5 c/w board (3) : ja = 44.6 c/w board (4) : ja = 31.3 c/w for ta=85 : board (1) : pd =0.57w board (2) : pd =0.88w board (3) : pd =1.46w board (4) : pd =2.08w caution: pd depends on the number of the pcb layers a nd area. pd values are determined through measurement. (3) 2.8w (2) 1.7w (1) 1.1w (4) 4.0w
14/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 terminal equivalent circuit (with typical resistance and capacitance values) 10k 10k 1 3 4 24 2 fc output sa output 11 5 9 8 7 6 12 pre-op input 5k 5k 24 18 16 14 17 22 ctl1, 2 50k 50k 17 22 21 24 24 24 pre-op output 30k 50k ( ) () 30 15 13 24 19 13 3 15 19 24 17 17 vc1, vc2 330k 33k 17 23 24 17 24 24 22 sarnf1, 2 30k 17 11 12 10p 24 24 24 24 vmfc 10k 17 1 3 4 17 24 24 2 23 17
15/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 application board schematic figure 15. pcb schematic
16/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 application board pattern figure 16. top silkscreen overlay figure 17. top layer figure 19. bottom layer figure 18. bottom silkscreen overlay
17/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 aso (area of safe operation) data (reference data) btl driver output (pin3, 4) vcc savm vmfc 15v vc1=vc2 3v ta 25 ton 0.1sec 0.1 1.0 110 i ce1 [a] v ce1 [v] 0.1 1.0 110 i ce2 [a] v ce2 [v] figure 20. upper powtr aso figure 21. lower powtr aso
18/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver output s, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong elec tromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
19/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 22. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that ex ceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage.
20/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 ordering information b d 8 2 7 1 e f v - e 2 product name package efv : htssop-b24 packaging and forming specification e2: embossed tape and reel (htssop-b24) marking diagram htssop-b24 (top view) d8271efv part number marking lot number pin 1 mark
21/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information package name htssop-b24 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
22/22 datasheet datasheet BD8271EFV tsz02201-0g1g0bk00250-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.oct.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 revision history date revision changes 5.aug.2013 002 new release
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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